RF & Microwave Components, Sub-Systems and Integrated Modules (up to 60 GHz) for Space, Defence and Commercial Wireless Applications.
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Total Integrated Packaging Solutions®
RF & Microwave Multi-Layer Components & 3-D Multi-Function Modules
Incorporating Active, Passive and MMIC Circuits.
Multilayer
The bonded multilayers, with embedded semiconductor devices,
MMICs, etched resistors, circuit patterns and plated-through via holes,
form a surface mount module which requires no further packaging.
In fact, the MMFM® structure becomes the package. This small outline,
low-profile structure is lightweight, and the surface-mount format is
compatible with microstrip or coplanar waveguide.
Multi-Mix® Products
RF Integrated Modules (VHF – MM Wave) Channelised Filters, I&Q
Networks, Mixers, Vector Modulators, Multi-Mix PICO™ Quadrature
Hybrids, Directional Couplers, Inline Multicouplers, Power Dividers,
Phase Shifters & Hybrid Junctions.
Key Features
High Density Circuit Integration.
Size & Weight Reduction.
Reduced Parts Count.
Volume Cellular Applications.
Improved Performance.
Reduced Production Costs.
Surface Mount
Hi-Rel and Space Qualified Products
Filters, Switch Filter Banks, Diplexers
and Multiplexers (up to 42GHz)
Power Dividers, Combiners & Quad Hybrids
Dual & Bi-Directional Couplers
Mixers, Vector Modulators & Frequency Doublers
I&Q Networks, Complex Modulators & Demodulators.
Hybrid Junctions & Beamformers
Voltage/Manual Controlled Phase Shifters
Electronic/Manual Control Attenuators
Packages
SMD, Flatpack, PCB Mount & Connectorised.
Merrimac's Space Qualified Products (MSQP)
Standard method for customers to procure Space Qualified Products based on Merrimac's 30+ years of Space Component, Supercomponent and Sub-System Design, Manufacture and Test. This program has proven to reduce cost and lead-time for Space Qualified Products.
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