This site uses cookies to store information on your computer. Some of these cookies are essential to make this site work and others help us to gain insight into how it is being used.
More
These cookies are set when you submit a form, login or interact with the site by doing something that goes beyond clicking some simple links. We also use some non-essential cookies to anonymously track visitors or enhance your experience of this site. If you're not happy with this, we won't set these cookies but some nice features on the site may be unavailable. To control third party cookies, you can also adjust your browser settings. If you wish to view any policies or terms of usage that you cannot find on this website, please contact us. You can change your mind and opt-out at any time by clicking the ✻ icon above.
I consent to cookies
I don't consent to cookies
Melcom
Latest Updates:

Thermal Interface Materials

TennMax have a comprehensive range of Thermal Interface Materials, offering performance advantages such as market leading thermal conductivity up to 11.0 w/m-k.

Click Here for Further Information on Tennmax's Thermal Interface Materials

 

Tennmax have the following types of Thermal interface Material:

  • Gap Filler Pad
  • Conductive Dispensable Jelly
  • Insulation Pads
  • Conductive Pads

Click Here For Datasheet


Featured Products

Click Below For The Waveguide FIP Dispensing Fabrication Presentation.

 

Dispensable Thermal Conductive Non-Silicon Jelly material provides high thermal conductivity 3 W/m-K, it is fully pre-cured, auto-dispensable thermal interface material designed for silicon-sensitive applications.

GP7F7123NS and GP7F7121NS

 

Principals

 

Request a Call Back

If you would like us to call you about the , please enter a few details below: