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EMI /Environmental Gaskets

Automated microdispensing technology 'Form-in-Place' (FIP) dispenses conductive elastomer gasket material directly onto metal or plastic housings to 0.2mm postional accuracy. Utilising Tennmax's market leading materials, FIP enables a smaller, lighter and more cost effective mechanical designs compared to traditional EMI sealing solutions.

Click Here For Further Information On Dispensed Gasketing

  • EMI Shielding Gasket
  • Environmental Gasket
  • Dual-Functional Gasket
  • FIP enables mechanical designs with:
    • No O Ring groove
    • Thinner Wall thickness (enabling lighter designs and greater PCB area)
    • Reduced fixing positions for the mating lid (lower part count, low cost designs)

Click Here For Datasheet

 

Principals

 

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