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EMI /Environmental Gaskets

Automated microdispensing technology 'Form-in-Place' (FIP) dispenses conductive elastomer gasket material directly onto metal or plastic housings to 0.2mm postional accuracy. Utilising Tennmax's market leading materials, FIP enables a smaller, lighter and more cost effective mechanical designs compared to traditional EMV/EMI sealing solutions.

Click Here For New Guide Datasheet

  • EMI Shielding Gasket
  • Environmental Gasket
  • Dual-Functional Gasket
  • FIP enables mechanical designs with:
    • No O Ring groove required
    • Thinner Wall thickness (enabling lighter designs and greater PCB area)
    • Reduced fixing positions for the mating lid (lower part count, lower cost designs)
  • The F5314 FIP material (for Environmental and EMI Solution) is fairly unique in the market. It is designed for higher frequency applications and proven to go up to 77 GHz and beyond
  • Dispensable Fluorosilcon FIP materials are ideal for harsh environments where chemical resistance is required (e.g. anti de-icers, anti rocket fuel)
  • FIP can be dispensed to a bead size as small as 0.33mm

 

Principals

 

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