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Latest Updates:

Thermal Interface Material

TennMax have a comprehensive range of Thermal Interface Materials, offering performance advantages such as market leading thermal conductivity up to 15.0 w/m-k.

Click here for Thermal Interface Selection Guide


New TennMax Leaflet, Aerospace 2023

New TIM Pad 13 WmK

Click here for datasheet


New TIM Pad 15 WmK

Click here for datasheet



TennMax have the following types of Thermal Interface Material:

  • Gap Filler Pad
  • Conductive Dispensable Jelly
  • Insulation Pads
  • Conductive Pads

Click Here For Datasheet

Dispensable Thermal Conductive Non-Silicon Jelly material provides high thermal conductivity 3 W/m-K, it is fully pre-cured, auto-dispensable thermal interface material designed for silicon-sensitive applications.

GP7F7123NS and GP7F7121NS




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